| 摘要 |
A method for manufacturing an LCD is provided to raise the purity of a copper wiring, thereby lowering the resistance of the copper wiring, by thermally processing the copper wiring to diffuse dopants, which are distributed in the copper wiring, to a surface of the copper wiring. A copper alloy is deposited on a substrate(111). The copper alloy is pattern-etched to form a copper alloy wiring(112). The copper alloy wiring is thermally processed, thereby raising the purity of the copper alloy wiring. The copper alloy contains a metal material having a larger HOMOFE(Heat Of Metal Oxide Formation Energy) than a copper. The copper alloy contains a zinc of 1 atomic percent or less. The thermal processing of the copper alloy wiring is performed under a temperature of 280 to 420 degrees centigrade. |
