| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a part of a solder starting to be melted from flowing out onto a rewiring circuit when a solder ball is heated in a reflow furnace when forming the solder bump. <P>SOLUTION: A protrusion 6 made of an insulating material such as polyimide for interruption of a flow of the solder starting to be melted by heating in the solder ball is formed on an upper surface of the rewiring circuit 3, on the side of a formation part of the solder bump with the aid of screen printing. Thereafter, the solder bump 5 is formed on the rewiring circuit 3. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
