| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which can reduce the breakage of a wafer due to a knife edge on an external edge of the semiconductor wafer, and an adhesive sheet to be used therefor. SOLUTION: In the method of manufacturing a semiconductor device, the adhesive sheet 12 is stuck on a pattern surface of the semiconductor wafer 11 having the peripheral edge subjected to chamfering processing, and the semiconductor wafer 11 is processed. The method has a process of sticking the semiconductor wafer 11 to the adhesive sheet 12; a process of embedding the semiconductor wafer 11 into the adhesive sheet 12, and burying a gap between a portion subjected to chamfering processing on the semiconductor wafer 11 and the adhesive sheet 12; and a process of applying thinning processing to the surface opposite to the surface of the semiconductor wafer 11 where the adhesive sheet 12 is stuck. COPYRIGHT: (C)2007,JPO&INPIT |
