| 摘要 |
A heat shield ( 10 ) that facilitates thermally processing a substrate ( 22 ) with a radiation beam ( 150 ) is disclosed. The heat shield is in the form of a cooled plate adapted to allow the radiation beam to communicate with the substrate upper surface ( 20 ) over a radiation beam path (BP), either through an aperture or a transparent region. The heat shield has an operating position that forms a relatively small gap ( 170 ) between the lower surface ( 54 ) of the heat shield and the upper surface of the wafer. The gap is sized such that the formation of convection cells ( 200 ) is suppressed during substrate surface irradiation. If convection cells do form, they are kept out of the radiation beam path. This prevents the radiation beam from wandering from the desired radiation beam path, which in turn allows for uniform heating of the substrate during thermal processing.
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