发明名称 |
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
Provided is a semiconductor device wherein a wire bonded to an island is surely prevented from being disconnected due to thermal shock, temperature cycle, and the like, in mounting, and further, a large increase in a manufacturing process time can be eliminated. In the semiconductor device, a semiconductor chip is die-bonded on the surface of the island, one end of a first wire is bonded to an electrode formed on the surface of the semiconductor chip to form a first bonding section, and the other end of the first wire is bonded to the island to form a second bonding section. The semiconductor device is resin-sealed. The semiconductor device is characterized in that a double bonding section formed by having the second wire bonded thereon is arranged on the second bonding section of the first wire bonded on the island. |
申请公布号 |
WO2006112393(A1) |
申请公布日期 |
2006.10.26 |
申请号 |
WO2006JP307935 |
申请日期 |
2006.04.14 |
申请人 |
ROHM CO., LTD.;HIROMOTO, HIDEKI;FUJII, SADAMASA;YAMAGUCHI, TSUNEMORI |
发明人 |
HIROMOTO, HIDEKI;FUJII, SADAMASA;YAMAGUCHI, TSUNEMORI |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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