WIRING BOARD AND PROCESS FOR PRODUCING THE SAME

摘要

[PROBLEMS] To provide a wiring board that permits forming of a Cu plating layer with satisfactory adherence to both of a ceramic layer and an Ag connection layer; and provide a process for producing the same. [MEANS FOR SOLVING PROBLEMS] Part of the surface of ceramic layer (12) and the upper surface of Ag connection layer (14) are covered with Ag thin-film layer (15). Cu wiring layer (11) is provided via the Ag thin-film layer (15) on the ceramic layer (12) and the Ag connection layer (14). This Ag thin-film layer (15) contributes to, in the forming of the Cu wiring layer (11) by electroless plating, increasing of the connection strength between the Cu wiring layer (11) and the Ag connection layer (14), and also contributes to forming of the Cu wiring layer (11) with satisfactory thickness on the ceramic layer (12).