IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an image sensor module having necessary minimum dimensions of thickness and area, and a method of manufacturing the same.

SOLUTION: A CMOS image sensor module using a wafer-level chip-size package technology includes an image-sensor-chip wafer on which partition walls of a lattice structure are formed in regions where image sensing regions are excluded, and a glass wafer on which an IR-filter coating layer and metal electrodes are formed. The image-sensor-chip wafer and the glass wafer are flip-chip bonded to simultaneously complete electrical connection and chip sealing. After metal wiring is added to the lower-side surface of the glass wafer, solder bumps and non-solder bumps are formed thereon.

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