发明名称 APPARATUS FOR LASER BEAM MACHINING
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an apparatus for laser beam machining, which apparatus can perform the laser beam machining uniformly along the machining line of a workpiece. <P>SOLUTION: The apparatus for the laser beam machining comprises a chuck table for holding the workpiece, a laser beam radiating means for radiating a pulsed laser beam, a machining feed means for relatively moving the chuck table and the laser beam radiating means, and a controlling means for controlling these means. The laser beam radiating means forms the shape of the spot of the pulsed laser beam to be an ellipse, the ratio of its minor axis to its major axis being set within the range from 1:5 to 1:20, and comprises a means for positioning the major axis of the spot in the direction of the machining feed. The controlling means controls the laser beam radiating means and the machining feed means such that the overlapping ratio of the elliptic spot satisfies the following condition, ä1-V/(H×L)}×100%=75 to 95%, where L(μm) shows the length of the major axis of the elliptic spot, H(Hz) shows the repeating frequency of the pulsed laser beam, and V(μm/s) shows the speed of the machining feed. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006289388(A) 申请公布日期 2006.10.26
申请号 JP20050110067 申请日期 2005.04.06
申请人 DISCO ABRASIVE SYST LTD 发明人 MORIKAZU YOJI
分类号 B23K26/073;B23K26/00;B23K26/08;B23K26/40;B23K101/40;H01L21/301;H01S3/00 主分类号 B23K26/073
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