| 摘要 |
PROBLEM TO BE SOLVED: To restrain contact resistance between bump electrodes and contacts from increasing due to an increase in the number of times that the bump electrodes of a semiconductor device make contact with the contactors. SOLUTION: In order to perform electrical inspection for the semiconductor device 1 with its external terminal equipped with the bump electrodes 2, this inspection device for semiconductor devices is equipped with the contacts 3 being harder than the bump electrodes 2 and making contact with the bump electrodes 2, and a socket body 8 for therein housing the contactors 3, with the contactors 3 capable of making contact with the bump electrodes 2 at a number of specific positions. In a plurality of inspection processes for semiconductor devices, positions at which the contactors make contact with the bump electrodes in each inspection process are kept from overlapping with those in another inspection process as far as possible, thereby making it possible to lower and stabilize contact resistance with the bump electrodes in inspection. COPYRIGHT: (C)2007,JPO&INPIT
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