发明名称 |
BRAZING FILLER METAL SHEET, ITS MANUFACTURING METHOD, AND ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a Pb-free brazing filler metal sheet which solves the problem of degradation in bonding reliability caused by voids in a brazing filler metal and a compound phase formed between particles. SOLUTION: The brazing filler metal sheet is composed of 70-90 mass% of Ag and the balance Sn, and has such a structure that a particle size of Ag is ≤300 μm and a particle size of Sn is ≤100 μm. A void ratio is ≤30%. Preferably, an aspect ratio of Ag particles is ≥1.2 on average. COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2006289474(A) |
申请公布日期 |
2006.10.26 |
申请号 |
JP20050117010 |
申请日期 |
2005.04.14 |
申请人 |
HITACHI METALS LTD |
发明人 |
DATE MASAYOSHI;CHIWATA NOBUHIKO |
分类号 |
B23K35/14;B22F3/02;B23K35/30;B23K35/40;C22C5/06;H01L21/52;H05K3/34 |
主分类号 |
B23K35/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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