发明名称 CONDUCTIVE PASTE AND LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 <p>A conductive paste contains a conductive powder of Ag-Pd and the like, and a second ceramic material whose ingredient kind is the same but composition is different compared with those of a first ceramic material (for instance, Pb(Zr, Ti)O<SUB>3</SUB> compound) which forms a ceramic layer. Further, a sintering temperature of the second ceramic material is permitted to be lower than that of the first ceramic material but higher than that of the conductive powder. An internal electrode layer is formed by using the conductive paste. Thus, the conductive paste which ensures excellent conductivity without causing peeling between the ceramic layer and the internal electrode layer, and improves coverage of the internal electrode layer is provided. A laminated ceramic electronic component which is manufactured by using the conductive paste and has excellent reliability are also provided.</p>
申请公布号 WO2006112096(A1) 申请公布日期 2006.10.26
申请号 WO2006JP300525 申请日期 2006.01.17
申请人 MURATA MANUFACTURING CO., LTD;HABUTA, EMI;HORIKAWA, KATSUHIRO;YAMADA, TAKAFUMI 发明人 HABUTA, EMI;HORIKAWA, KATSUHIRO;YAMADA, TAKAFUMI
分类号 H01L41/083;H01B1/22;H01G4/12;H01G4/30;H01L41/187;H01L41/273;H01L41/297 主分类号 H01L41/083
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