BOND AND JOINING METHOD FOR BOND

摘要

A bond and a joining method for the bond. A solder (13) is molten and adhered to the joining face of the terminal (2) of a rail bond and the outer side face of the rail head part (6A) of a rail (6) to which the terminal is joined. The terminal (2) is applied to the outer side face of the rail head part (6A) to which the solder is adhered so that its tilted face is positioned on the upper side, and the terminal (2) is pressed against the outer side face of the rail head part (6A) while heating the solder by a pressing means (8) of a clamp device (7) formed of the pressing means (8), a pressing adjust screw (9), a strut (10), a fixing screw (11), and a clamp (12) to adhere the terminal to the rail. The height of the clamp device (7) is set lower than that of the rail (6). Then, the bond can be joined to the vehicle rail with a high joining strength by filling the solder between the tilted face and the side face of the rail head part while heating the solder. The method can join the bond to the vehicle rail with the high joining strength.