发明名称 |
LEITERPLATTENSUBSTRAT MIT HOHER DICHTE UND HERSTELLUNGSMETHODE |
摘要 |
The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer having a surface roughness of no greater than 6.0 microns. A first conductive layer is attached to the dielectric layer. In one embodiment, the dielectric layer comprises a laminate that comprises a cloth having a uniform weave and a resin that is consistently impregnated within the uniform weave. A removable layer may be attached to the laminate and removed prior to metallizing of the first conductive layer. Various embodiments are described. |
申请公布号 |
DE69933225(D1) |
申请公布日期 |
2006.10.26 |
申请号 |
DE1999633225 |
申请日期 |
1999.07.22 |
申请人 |
ISOLA LAMINATE SYSTEMS CORP. |
发明人 |
POMMER, J.;GOTRO, T.;ANDROFF, M.;HEIN, D.;ZARECKI, J. |
分类号 |
H05K1/03;H05K1/09;H01L23/14;H01L23/538;H05K1/02;H05K1/11;H05K3/02;H05K3/06;H05K3/28;H05K3/38 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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