| 摘要 |
The device has a plate portion (58) made of a semiconductor material and covering a conducting layer disposed in parallel to a support portion (62). Two electronic circuits (43, 44) are fixed to the support portion and include integrated circuit chips (45-47). The plate is connected to the support portion through solder balls (54) distributed around each electronic circuit and in contact with the conducting layer. An independent claim is also included for a method for fabricating electronic circuits. |
