发明名称 SURFACE-MOUNT SAW DEVICE
摘要 The present invention provides a surface-mount SAW device configured to prevent sealing resin layer coated all over the top surface of a piezoelectric substrate from becoming charged even if the piezoelectric substrate forming the SAW device is made of a pyroelectric material. The SAW device is composed of: a mounting substrate 2; a SAW chip 15 provided with a piezoelectric substrate 18, an IDT electrode 17 formed on one surface of said piezoelectric substrate, and connection pads 16 connected via conductor bumps 10 to conductor traces 5; and a sealing resin layer 21 coated all over the outer surface of the SAW chip flip-chip mounted on the mounting substrate and extended down to the top surface of the mounting substrate to define an airtight space S between the IDT electrode and the mounting substrate; wherein the crystal structure of the piezoelectric substrate belongs to any one of point groups C 1 , C 2 , C S , C 2V , C 4 , C 4V , C 3 , C 3V , C 6 and C 6V in terms of Schoenflies symbols; characterized in that the conductivity of the piezoelectric substrate is increased to suppress charging of the sealing resin layer.
申请公布号 EP1715581(A1) 申请公布日期 2006.10.25
申请号 EP20040821283 申请日期 2004.11.12
申请人 TOYO COMMUNICATION EQUIPMENT CO., LTD. 发明人 ONOZAWA, YASUHIDE
分类号 H03H9/25;H03H9/10;H03H9/145 主分类号 H03H9/25
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