发明名称 PRESSURE SENSITIVE ADHESIVE COMPOSITION
摘要 <p>The present invention has its object to provide a pressure sensitive adhesive composition which can be applied using no organic solvent and which manifests excellent pressure sensitive adhesion characteristics. This object can be achieved by a pressure sensitive adhesive composition which comprises, as essential constituents, the following: (A) a hydrolyzable silyl group-containing organic polymer containing at least 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 15,000 to 100,000; (B) a hydrolyzable silyl group-containing organic polymer containing 0.3 to 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 500 to 15,000; and (C) a tackifier resin.</p>
申请公布号 EP1715016(A1) 申请公布日期 2006.10.25
申请号 EP20050709366 申请日期 2005.01.26
申请人 KANEKA CORPORATION 发明人 UEDA, KAZUHIKO;IWAKIRI, HIROSHI
分类号 C08G65/336;C09J7/02;C09J11/06;C09J143/04;C09J171/00;C09J201/10 主分类号 C08G65/336
代理机构 代理人
主权项
地址