| 摘要 |
A semiconductor device is provided to reduce a used amount of a sealing material and prevent a non-filling phenomenon of a sealing material by using the sealing material. A lead frame(12) is loaded with a semiconductor die(11) and is electrically connected to the semiconductor die. A sealing portion(15) seals the lead frame and the semiconductor die. The sealing portion(15) includes a first surface, a second surface, and third four surfaces. The first surface of the sealing portion is flat and has a predetermined area. The second surface is flat. The four surfaces are formed around the first surface and the second surface. Each of the third four surfaces has a smaller width than that of the first or second surface. A predetermined part of the lead frame protrudes through one of the third four surfaces of the sealing portion. Two sealing portion fraction portions are formed at third two surfaces.
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