| 摘要 |
The arrangement comprises a substrate (15) with a plurality of electrically conductive traces (10) and at least one light emitting device (2), a light emitting diode or a chip comprising one ore more light emitting diodes, preferably surface mounted on the substrate (15) and connected with a first and a second electrical electrode (21, 22) to said electrically conductive traces (10). A ring (6), that is placed onto the substrate (15) and that surrounds the light emitting device (2) comprises a lower surface (62), that is attached to the substrate (15), and an upper surface (61), that is designed to reflect the light emitted by the light emitting device (2) into a desired direction. Besides the advantageous collection and redirection of light, the ring (2) allows precise placement of an encapsulation (3) or a lens (31) that may be part of the encapsulation (3) and absorbs thermal energy from the encapsulation (3) that has been transferred from the top and sidewalls of the light emitting device (2). |
