| 发明名称 |
Die attach adhesives with improved stress performance |
| 摘要 |
<p>Adhesive compositions containing a base compound or resin and an epoxy resin with vinyl functionality, without a curing agent for the epoxy resin, show enhanced stress performance. The compositions can be used in microelectronic applications.</p> |
| 申请公布号 |
EP1715004(A1) |
申请公布日期 |
2006.10.25 |
| 申请号 |
EP20060007866 |
申请日期 |
2006.04.13 |
| 申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
EUNSOOK, CHAE |
| 分类号 |
C08L63/10;C09J201/02;H01L21/52 |
主分类号 |
C08L63/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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