Manufacturing method of electrodeposited copper foil, electrodeposited copper foil, copper-clad laminate and printed wiring board,申请号EP20000304865-传众专利搜索

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发明名称	Manufacturing method of electrodeposited copper foil, electrodeposited copper foil, copper-clad laminate and printed wiring board
摘要
申请公布号	EP1059367(B1)	申请公布日期	2006.10.25
申请号	EP20000304865	申请日期	2000.06.08
申请人	MITSUI MINING & SMELTING CO., LTD.	发明人	IMADA, NOBUYUKI;HIRASAWA, YUTAKA;HARA, YASUJI;MATSUSHITA, NAOYA
分类号	C25D1/04;C25D3/38;C25D21/12;H05K1/09;H05K3/02	主分类号	C25D1/04
代理机构		代理人
主权项
地址

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