发明名称 Method and apparatus for determining endpoint of semiconductor element fabricating process
摘要 Standard patterns of differential values of interference light that correspond to a predetermined step height of the first material being processed and standard patterns of differential values of interference light that correspond to a predetermined remaining mask layer thickness of the material are set. These standard patterns use wavelengths as parameters. Then, the intensities of interference light of multiple wavelengths are measured for a second material that has the same structure as the first material. Actual patterns with wavelength as parameter are determined from differential values of the measured interference light intensities. Based on the standard patterns and the actual patterns of the differential values, the step height and the remaining mask layer thickness of the second material are determined.
申请公布号 US7126697(B2) 申请公布日期 2006.10.24
申请号 US20060340559 申请日期 2006.01.27
申请人 发明人
分类号 G01B11/02 主分类号 G01B11/02
代理机构 代理人
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