发明名称 |
Method for reduction of electromagnetic interference in integrated circuit packages |
摘要 |
EMI radiation in an integrated circuit device package ( 10 ) is reduced or eliminated by the introduction of a magnetic material into the encapsulating medium ( 14 ). The permeance of the magnetic encapsulating medium ( 14 ) affects the inherent series inductance of the lead frame conductors ( 16 ) to thereby reduce electromagnetic interference. Ferrite microbeads ( 30 ) are formed around the lead frame conductors ( 16 ) to contain the magnetic flux ( 32 ) generated by an electrical current signal and to attenuate the effects of mutual inductance. |
申请公布号 |
US7125743(B2) |
申请公布日期 |
2006.10.24 |
申请号 |
US20030684072 |
申请日期 |
2003.10.13 |
申请人 |
INTERMEC IP CORP. |
发明人 |
KOENCK STEVEN E. |
分类号 |
H01L21/44;H01L23/50;H01L23/552;H01L23/58 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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