Polishing pad having a groove arrangement for reducing slurry consumption

摘要

A polishing pad ( 200 ) that includes a polishing layer ( 204 ) having a polishing region ( 208 ) for polishing a wafer ( 220 ). The polishing layer includes a set of inflow grooves ( 232 ) that extend into the polishing region and a set of outflow grooves ( 236 ) that extend out of the polishing region. The inflow and outflow grooves cooperate with one another to enhance the utilization of a polishing slurry during polishing of the wafer.