发明名称 Method of fabricating semiconductor device
摘要 A method of fabricating a semiconductor device includes the steps of forming a step region having a mesa shape in a direction of <011> or <0-11> on a (100) plane of an InP-based compound semiconductor crystal, and burying the step region with InP-based buried layers grown by vapor-phase growth by supplying a base gas to which a chlorinated organic compound is added, the organic chlorine compound including at least two carbon atoms, and each of the carbon atoms is bonded to one chlorine (Cl) atom in one molecule. The chlorinated organic compound is any one of 1,2-dichloroethane, 1,2-dichloropropane, and 1,2-dichloroethylene.
申请公布号 US7125735(B2) 申请公布日期 2006.10.24
申请号 US20050052114 申请日期 2005.02.08
申请人 EUDYNA DEVICES, INC. 发明人 TAKEUCHI TATSUYA
分类号 H01L21/00;H01L21/205;H01L21/20;H01S5/227;H01S5/323 主分类号 H01L21/00
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