发明名称 |
Encapsulated electronic sensor package |
摘要 |
An electronic package includes a circuit board and a capsule layer encasing the circuit board and forming an immersible electronic module. A housing receives the electronic module and forms a protective shell around the electronic module.
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申请公布号 |
US7126063(B2) |
申请公布日期 |
2006.10.24 |
申请号 |
US20030673898 |
申请日期 |
2003.09.29 |
申请人 |
TYCO ELECTRONICS CANADA, LTD. |
发明人 |
WEISZ-MARGULESCU ADAM;ALBINO ALAN;ROBICHAUD ROGER |
分类号 |
H01L23/28;G01D11/24;H05K5/02;H05K5/06;H05K7/00 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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