| 摘要 |
<p>A manufacturing method of a semiconductor device formed in a chip size package is improved to enhance a yield and reliability. A window (20) to expose first wirings (3) is formed only in a region of a semiconductor substrate (1) where the first wirings (3) exist. As a result, area of the semiconductor substrate (1) bonded to a supporting body (4) through an insulation film (2) and a resin (5) is increased to prevent cracks in the supporting body (4) and separation of the semiconductor substrate (1) from the supporting body (4). A slit (30) is formed along a dicing line after forming the window (20), the slit (30) is covered with a protection film (10) and then the semiconductor substrate (1) is diced into individual semiconductor dice. Thus, separation on a cut surface or at an edge of the semiconductor dice, which otherwise would be caused by contact of the blade in the dicing can be prevented.</p> |
