PICK AND PLACE APPARATUS FOR SEMICONDUCT

摘要

A semiconductor processing apparatus is provided to eliminate the necessity of an additional process for adjusting an absorption reference point by disposing an ejector and a rotary picker in the same axis and by aligning a package on a wafer frame by a relative movement with a work table. A wafer frame(W) supplied from an on-loading unit is placed on a work table(200). An ejector separates a process material on the wafer frame placed on the work table into individuals. A rotary picker picks up the process material from the work table. The ejector and the rotary picker are disposed in the same axis. The processed material on the wafer frame is aligned by a relative movement with the work table. The ejector and the rotary picker are incorporated to be capable of transferring in the X-axis or Y-axis direction. The work table is installed to be capable of transferring in the Y-axis or X-axis direction, aligning the processed material on the wafer frame.