| 摘要 |
FIELD: electronic engineering; high-power microwave transistors and small-scale integrated circuits built around them. ^ SUBSTANCE: proposed method for producing high-power microwave transistors includes formation of transistor-layout semiconductor wafer on face side, evaporation of metals, application and etching of insulators, electrolytic deposition of gold, formation of grooves on wafer face side beyond transistor layout for specifying transistor chip dimensions, thinning of semiconductor wafer, formation of grooves on wafer underside just under those on face side, formation of through holes for grounding transistor leads, formation of integrated heat sinks for transistor chips around integrated heat sink followed by dividing semiconductor wafer into transistor chips by chemical etching using integrated heat sinks of transistor chips as mask. ^ EFFECT: enhanced power output due to reduced thermal resistance, enhanced yield, and facilitated manufacture. ^ 2 cl, 1 dwg, 1 tbl |
