| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a solid-state image sensor package capable of being mounted in parallel with a mounting board, a sold-state image sensor mounting board, a digital camera and a method for mounting a solid-state image sensor package. <P>SOLUTION: Electrode pads 116 are provided at left and right sides of a rear face side of a reinforcing plate 108, and dummy pads 118 are arranged on a straight line connecting end parts of the electrode pads 116 to each other and provided so as to enclose the surrounding of the reinforcing plate 108. The surrounding of a CCD package 122 is connected to a mounting board 112 through solder balls to thereby be able to hold the CCD package 122 horizontally with respect to the mounting board 112 compared with when only left and right parts of the CCD package 122 are connected to the mounting board 112. Consequently, in a digital camera, the central axis of a CCD 52 is made to coincide with an optical axis of a lens, optical performance by the CCD 52 is improved and the quality of the digital camera is also improved. <P>COPYRIGHT: (C)2007,JPO&INPIT |
