| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal-ceramic bonding substrate capable of preventing the occurrence of a solder crack and preventing the occurrence of a crack on a ceramic substrate, even if a Pb-free solder is used for fixing a heat dissipation plate on the metal-ceramic bonding substrate. SOLUTION: In the metal-ceramic bonding substrate in which one surface of a metal plate 18 for fixing a heat dissipating plate is joined to one surface of the ceramic substrate 10 via a brazing member 16, the heat dissipating plate 22 is fixed on the other surface of the metal plate 18 with the Pb-free solder 20, and a non-joining portion having a predetermined width is provided on the peripheral edge or near the peripheral edge of the one surface of the metal plate 18. COPYRIGHT: (C)2007,JPO&INPIT |
