| 摘要 |
PROBLEM TO BE SOLVED: To prevent a sticky particle from being generated out of a dicing tape in the dicing to cut out a delivery element chip from a wafer. SOLUTION: A delivery element chip 1a composed of a resin layer 7 which has a delivery port, etc. is formed on the wafer. A coating layer 10 is provided in the rear surface of the wafer before the process of cutting the wafer 1 by a dicing blade 52 along with a cutting line 9, and then a recess 11 is formed by patterning the coating layer 10 so as to correspond to the cutting line 9. The sticky particle is prevented from being generated out of the dicing tape 51 by controlling the amount of incision of the dicing blade 52 so that the edge of a blade may be located in the recess 11 of the wafer rear surface and may not cut into the dicing tape 51, while a highly-precise dicing not to generate a burr and the like in the rear surface of the delivery element chip can be performed. COPYRIGHT: (C)2007,JPO&INPIT |
