发明名称 METHOD OF MANUFACTURING GROUP III-V COMPOUND SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To improve electron mobility of HEMT even by doping at the same carrier concentration in comparison with the conventional technology, by optimizing the balance of film thickness between an AlGaAs layer and a GaAs layer forming a spacer layer. SOLUTION: An In<SB>y</SB>Ga<SB>(1-y)</SB>As layer with a mixed crystal ratio y of 0.15-0.30 is formed as a channel layer 5 of HEMT at a film thickness of 5-15 nm, and an AlGaAs layer 6a (or 4a) and a GaAs layer 6b (or 4b) are combined and used for a spacer layer 6 (or 4). An Al<SB>x</SB>Ga<SB>(1-x)</SB>As layer with a mixed crystal ratio x of 0.26-0.50 is formed at a film thickness of 0.1-7.0 nm as the AlGaAs layer 6a or 4a on the side of a carrier supply layer 7 (or 3), and the GaAs layer 6b (4b) is formed at a film thickness of 0.1-7.0 nm on the side of the channel layer 5. In this case, the spacer layer 6 (or 4) including the AlGaAs layer and the GaAs layer does not exceed 10 nm in thickness. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006286755(A) 申请公布日期 2006.10.19
申请号 JP20050102004 申请日期 2005.03.31
申请人 HITACHI CABLE LTD 发明人 HIROOKA CHIHIRO;MEGURO TAKESHI
分类号 H01L29/812;H01L21/338;H01L29/778 主分类号 H01L29/812
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