发明名称 CONDUCTIVE PASTE COMPOSITION, AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste composition with which a covered film having a sufficient thickness can be formed by a single time of coating work. SOLUTION: This conductive paste composition is composed of phenolic resin, melamine resin, conductive powder, solvent, and divalent alcohol having an etheric bond. This conductive paste composition includes both of the composition containing indispensable components, and of the composition containing indispensable components and the components other than these indispensable components. Moreover, in the above description, "conductivity" means that a volume resistance value is at least 1×10<SP>-3</SP>cm×Ωor less. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006286367(A) 申请公布日期 2006.10.19
申请号 JP20050103932 申请日期 2005.03.31
申请人 DAINIPPON PRINTING CO LTD;THE INCTEC INC 发明人 UCHIUMI TSUTOMU;NAGASHIMA MASAYUKI;KOBAYASHI MASARU;SHIROGANE HIROYUKI;MORI MASAYUKI;USUKI NAOMI
分类号 H01B1/22;H01B1/24;H05K3/12 主分类号 H01B1/22
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