发明名称 THIN FILM FORMING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a thin film forming apparatus uniformly forming the whole thickness of a film which is formed on a continuous strip support with a droplet ejection head. SOLUTION: The wetting tension on the surface of the continuously supplied support is 30 to 70 dyne/cm. The surface tension of the coating liquid is 15 to 50 dyne/cm. The wetting tension on the surface of the support is made higher than the surface tension of the coating liquid. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006281176(A) 申请公布日期 2006.10.19
申请号 JP20050108506 申请日期 2005.04.05
申请人 KONICA MINOLTA HOLDINGS INC 发明人 MIYAGAWA ICHIRO;MINAMINO DAIKI;SHIMIZU NAOKI
分类号 B05C5/00;B05C9/10 主分类号 B05C5/00
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