发明名称 |
THIN FILM FORMING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a thin film forming apparatus uniformly forming the whole thickness of a film which is formed on a continuous strip support with a droplet ejection head. SOLUTION: The wetting tension on the surface of the continuously supplied support is 30 to 70 dyne/cm. The surface tension of the coating liquid is 15 to 50 dyne/cm. The wetting tension on the surface of the support is made higher than the surface tension of the coating liquid. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2006281176(A) |
申请公布日期 |
2006.10.19 |
申请号 |
JP20050108506 |
申请日期 |
2005.04.05 |
申请人 |
KONICA MINOLTA HOLDINGS INC |
发明人 |
MIYAGAWA ICHIRO;MINAMINO DAIKI;SHIMIZU NAOKI |
分类号 |
B05C5/00;B05C9/10 |
主分类号 |
B05C5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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