发明名称 Method for predicting and optimizing chip performance in cured thermoset coatings
摘要 Disclosed is a method for evaluating chip performance of a cured coating system. In one embodiment, the method includes providing a coated substrate comprising a substrate and a cured film of a first coating composition thereon, measuring elastic work energy (W<SUB>e</SUB>/W<SUB>tot</SUB>) of the cured film, and calculating a % C.P. of the cured film via the formula: % C.P.=7.61636-0.225473 (W<SUB>e</SUB>/W<SUB>tot</SUB>) wherein a % C.P. of equal to or less than about 3.5% correlates to a total paint loss of equal to or less than 5% of a coating system comprising the first coating composition. The disclosed method predicts the gravelometer chip performance of a cured multilayer coating system comprising a first coating composition and a topcoat by measuring the measuring elastic work energy (W<SUB>e</SUB>/W<SUB>tot</SUB>) of the cured first coating system alone. In one embodiment, chip performance can be predicted without topcoat application and independent of topcoat composition.
申请公布号 US2006234404(A1) 申请公布日期 2006.10.19
申请号 US20050106284 申请日期 2005.04.14
申请人 BASF CORPORATION 发明人 DECEMBER TIMOTHY S.;FENWICK MARC B.;LANZA JOANN;KOBAYASHI-SAN YOSHIKO;SHINOHARA IPPEI;KUBISH SCOTT
分类号 H01L21/66;G01R31/26 主分类号 H01L21/66
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