发明名称 COMPOSITION FOR FORMING MOLDING, DEGREASED BODY, AND SINTERED COMPACT
摘要 <P>PROBLEM TO BE SOLVED: To provide a composition for forming a molding used for safely obtaining a degreased body at a low cost, to provide a degreased body produced using the composition for forming a molding and having excellent characteristics, and to provide a sintered compact. <P>SOLUTION: The composition 10 for forming a molding comprises: powder 1 mainly composed of an inorganic material; and a binder 2 containing a resin 3 decomposable by ozone. As the resin 3 decomposable by ozone, the one decomposed at about 50 to 190&deg;C is preferable, and, specifically, the one essentially composed of an aliphatic carbonic acid ester based resin is preferable. As the binder 2, the one further comprising a second resin 4 decomposed after the decomposition of the resin 3 is preferable, and the decomposing temperature thereof is preferably about 190 to 600&deg;C. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006282475(A) 申请公布日期 2006.10.19
申请号 JP20050106875 申请日期 2005.04.01
申请人 SEIKO EPSON CORP 发明人 SAKATA MASAAKI;HAYASHI JUNICHI;NAKABAYASHI OKIE
分类号 C04B35/63;C08K5/00;C08L69/00;C08L101/00 主分类号 C04B35/63
代理机构 代理人
主权项
地址