| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board structure and its manufacturing method which ensure high reliability and superior electrical characteristics by reducing or avoiding any detachment or damage of resins during the mechanical cutting process. <P>SOLUTION: On this multilayer wiring board, multiple resin layers and multiple wiring layers are laminated together, and multiple wiring boards having no core substrates are mounted. The multilayer wiring board is cut into some pieces of wiring boards, which allows each of those wiring boards to be mounted uninterruptedly through a single resin layer. <P>COPYRIGHT: (C)2007,JPO&INPIT |
