| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform heat radiation of a solid imaging element held in a ceramic package inexpensively. <P>SOLUTION: A solid imaging device 10 is constructed in such manner that the solid imaging element 11 is held in the ceramic package 12 and is mounted on a circuit substrate 1. The back of the solid imaging element 11 is exposed via a through-hole 16, and directly faces on the side of the circuit substrate 1. The through-hole 16 is formed through the ceramic package 12, and the opening of the through-hole 16 is sealed by the solid imaging element 11. The low-cost radiation of the solid imaging element 11 can be attained. <P>COPYRIGHT: (C)2007,JPO&INPIT |
