| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal/ceramic joined substrate which can effectively prevent the generation of cracks in a solder or a ceramic substrate even when a Pb-free solder is used in the case that a heat dissipating plate is fixed on the metal/ceramic joined substrate. SOLUTION: In the metal/ceramic joined substrate wherein a metal plate 18 for fixing a heat dissipating plate 22 is joined on one surface of the ceramic substrate 10 through a solder 16, a metal plate of copper or a copper alloy having a Vickers hardness of 40-60 is used as the metal plate 18 for fixing the heat dissipating plate. The heat dissipating plate 22 is fixed on the other surface of the metal plate 18 for fixing the heat dissipating plate by a Pb-free solder 20. COPYRIGHT: (C)2007,JPO&INPIT |
