| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing chips in stable quality with higher manufacturing yield without generation of cracks of wafer and damages of chips from a thin film wafer. SOLUTION: The method of manufacturing chips using the laser beam comprises the steps of (a) adhering an adhesive tape for protection to the side of a pattern surface of the wafer on which circuits are formed, (b) grinding the rear surface of the wafer in the opposite side of the surface where the adhesive tape for protection is adhered, (c) adhering an adhesive tape for wafer dicing on the adhesive tape for protection without peeling the adhesive tape for protection, (d) cutting the wafer together with the adhesive tape for protection into fractional pieces with the laser dicing, and (e) picking up chips from the wafers cut into the fractional pieces. COPYRIGHT: (C)2007,JPO&INPIT |
