FUNCTIONAL DEVICE, ITS MANUFACTURING METHOD, AND LIQUID JETTING HEAD

摘要

PROBLEM TO BE SOLVED: To solve the problem that a wiring pattern on the board is short-circuited when metallic foreign matters are peeled off, the metallic foreign matters enter a hole section like an ink passage in the substrate of an inkjet head and the nozzle of the liquid jetting head is clogged by preventing the over-etching of the recess section from occurring and preventing metallic foreign matters from remaining on the bottom surface of the recess section when a recess for releasing an adhesive is formed. SOLUTION: This functional device is formed by a plurality of the boards are bonded with an adhesive. In the functional device, the recess section which becomes a region for releasing the excessive adhesive is formed at least on one of the bonding surfaces of the boards which are bonded to each other. The shape of the opening section of the recess section is formed in such a manner that the acute angle of which may not become the direction side being orthogonal with the crystal orientation 3 of the board. COPYRIGHT: (C)2007,JPO&INPIT