发明名称 Wiring structure and recording apparatus and electronic apparatus including wiring structure
摘要 A wiring structure includes a substrate, a first circuit and a second circuit, provided on the substrate, a first wire, provided on the substrate, and connecting the first circuit and the second circuit, the first wire having a first length, and a second wire, provided on the substrate, and connecting the first circuit and the second circuit, the second wire having the first length and including a first swirled part.
申请公布号 US2006231287(A1) 申请公布日期 2006.10.19
申请号 US20060392623 申请日期 2006.03.30
申请人 SEIKO EPSON CORPORATION 发明人 NAKAYAMA TERUO
分类号 H05K1/00 主分类号 H05K1/00
代理机构 代理人
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