| 摘要 |
Disclosed is a semiconductor device which enables to easily perform a visual inspection of the bonded state between a lead and a land of wiring board. This semiconductor device comprises a lead which is characterized in that at least a part of the lower surface thereof is exposed from the lower surface of the encapsulation resin, while the end face thereof is exposed from the lateral surface of the encapsulation resin. The lower surface of the lead is provided with a groove which extends to the outer edge of the lead. |
