| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a retaining table for retaining a wafer from being heated when the wafer is processed using a laser light. <P>SOLUTION: The retaining mechanism for the wafer includes: at least a wafer retaining part 7 having a retaining surface 7a for retaining the wafer W; and a suction part 21b formed on an outer peripheral side of the wafer retaining part 7, and retains the wafer W on the retaining surface 7a by suction force transmitted from the suction part 21b to the retaining surface 7a through an outer peripheral end of the wafer retaining part 7. Since suction/retaining is performed even if a fine pore reaching a back surface from a surface of the wafer retaining part 7 is not formed, the wafer retaining part 7 is constituted by selecting the best material having permeability and dispersion property relative to a wavelength of the laser light. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
