| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive epoxy resin composition for sealing corresponding to a semiconductor package with a fined pitch and having excellent insulating properties and good dispersibility of carbon black. SOLUTION: A pre-kneaded composition (a master batch) comprises (A) the carbon black, (B) an epoxy resin or a phenol resin curing agent and (C) an aliphatic low-melting compound and/or a silicone low-melting compound. The content of (A) the carbon black is 0.1-30 wt.% and the content of (C) the aliphatic low-melting compound and/or silicone low-melting compound is 0.1-10 wt.%. The epoxy resin composition for sealing the semiconductor comprises (D) the epoxy resin, (E) the phenol resin curing agent, (F) a curing accelerator, (G) an inorganic filler and (H) the pre-kneaded composition as essential components, respectively. COPYRIGHT: (C)2007,JPO&INPIT
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