Semiconductor chip mounting body and manufacturing method thereof

摘要

A semiconductor chip ( 20 ) including a protruding electrode (bump) ( 23 ) in an external extraction electrode is mounted on a wiring board ( 10 ), and a semiconductor chip ( 30 ) is mounted on the semiconductor chip ( 20 ). Electrical connections between a wiring layer ( 12 ) of the wiring board ( 10 ) and the protruding electrode ( 23 ) of the semiconductor chip ( 20 ) and between the protruding electrodes of the semiconductor chips ( 20 ) and ( 30 ) are established by electrolytic plating. Stable connections between the wiring layer ( 12 ) and the protruding electrode ( 23 ) and between the protruding electrodes of the semiconductor chips ( 20 ) and ( 30 ) are established by plating films ( 24 ) and ( 33 ).