Method of forming a substrateless semiconductor package

摘要

A method of forming a substrateless semiconductor package ( 10 ) includes forming a carrier ( 16 ) on a base plate ( 12 ) and attaching an integrated circuit (IC) die ( 32 ) to the carrier ( 16 ). The IC die ( 32 ) then is electrically connected to the carrier ( 16 ). A molding operation is performed to encapsulate the IC die ( 32 ), the electrical connections ( 36 ) and the carrier ( 16 ). Thereafter, the base plate ( 12 ) is removed.