ELECTROSTATIC DISCHARGE DEVICE FOR BONDING PAD

摘要

An electrostatic discharge device for a bonding pad is provided to solve a problem of the occupying area of an electrostatic discharge device and miniaturize an integrated circuit by disposing a diode under a bonding pad wherein an electrostatic discharge circuit is constituted by the diode. A conductive layer for connecting a power terminal and a conductive layer for connecting a ground terminal are connected to the power terminal and the ground terminal, respectively. A first PN diode part(36) is formed in a first region of a semiconductor substrate region under a bonding pad, serially connected between a signal line and the conductive layer for connecting the power terminal. A second PN diode part(37) is formed in a second region of the semiconductor substrate region under the bonding pad, serially connected between the signal line and the conductive layer for connecting the ground terminal. The first and the second PN diode parts are composed of a plurality of unit cells(36a,36b,37a,37b) having impurity regions of first and the second conductivity types to form PN junctions, respectively.