| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition to be used in a manufacturing process of a semiconductor such as an IC, manufacturing a circuit board for a liquid crystal, a thermal head or the like, and other photo-fabrication processes, and to provide a pattern-forming method using the positive photosensitive composition, particularly, to provide a positive photosensitive composition excellent in resolution and improved in line edge roughness and pattern collapse even for formation of a fine pattern in a size of 100 nm or less, and to provide a pattern-forming method using the composition. <P>SOLUTION: The positive photosensitive composition contains: (A) a resin having at least one kind of repeating unit having a specific lactone structure at a side chain and being capable of decomposing by an action of an acid to increase the solubility with an alkali developing solution; and (B) a compound capable of generating a specific acid upon irradiation with actinic rays or radiation. A pattern forming method using the above composition is provided. <P>COPYRIGHT: (C)2007,JPO&INPIT |
