| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip card manufacturing method, with which an IC chip is hardly broken in thermocompression, and to provide a chip card where the inner IC chip is not broken easily, due to the external cause. <P>SOLUTION: The IC chip 15 is arranged between an under layer 11 and an over layer 14, so as to manufacture the chip card by thermocompression. For the IC card to be manufactured, foaming sheets 19, 19 are arranged respectively on the upper and lower parts. <P>COPYRIGHT: (C)2007,JPO&INPIT |
